基本解释

• [机械工程]焊接封装

英汉例句

双语例句

• The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
  该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。

专业释义

机械工程

• 焊接封装