mechanical polishing
基本解释
- [机] 机械抛光
英汉例句
- Mechanical polishing: by means of high-speed polishing compound polishing with a round metal parts, in order to improve the machining process surface brightness.
机械抛光：借助于高速旋转的抹有抛光膏的抛光轮，以提高金属制件表面光亮度的机械加工过程。 - The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。 - Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光（CMP）的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
双语例句
词组短语
- electrolytic mechanical compound polishing 电解机械复合抛光
- mechanical l polishing 机械抛光
- chemical mechanical polishing process 化学机械抛光
- mechanical polishing process 机械抛光
- Chemical Mechanical Polishing 化学机械抛光;化学机械研磨;技术;研磨
短语
专业释义
- 机械抛光
Nowadays, IC technologyreaches 45nm node. Complex nano-technologies such as sub-wavelength lithographyand Chemical-Mechanical Polishing (CMP) cause more and more large processvariations and therefore seriously deteriorate the yield.
如今，集成电路工艺到达45nm节点，随着亚波长光刻和化学机械抛光等复杂纳米工艺的普遍采用，越来越严重的工艺参数偏差造成了集成电路成品率的快速恶化。机械工程
- 机械抛光
- 机械力研磨