bonding lead

基本解释

This paper introduces in detail the component and technology process of printed circuit board hand tin-lead bonding of auto instrument.
详细介绍了汽车仪表印刷电路板手工锡焊的组成要素及工艺过程。
It seemed that higher lead absorption by the fetus was related to the newly emerged lead bonding site in fetus, especially during the calcification of bones.
胎鼠体铅含量于妊娠后期较前期明显增加；胎鼠铅含量随胎龄的增加可能与妊娠后期胎鼠体内不断出现新的铅结合位点，特别是骨骼钙化有关。
A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一种激光焊接装置，能够迅速且方便地进行带覆层导线的覆层除去作业、对该带覆层导线和端子的激光焊接作业。
ip.com