anodic bonding

基本解释

The sol-gel technology formed a uniform sample coating used in anodic bonding.
因此本文认为共阳极法是一种可靠的键合多层晶片的技术。
Under the assumption of only tow kinds of mobile alkali ions in glass, a model for the metal glass electric field assisted anodic bonding is proposed.
在假设玻璃中仅有两种可动碱金属离子的情况下，提出了一个金属玻璃电场辅助阳极连接模型。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。

阳极键合
The glass thin film was suitable for anodic bonding as the intermediate layer. It is essential for realizing anodic bonding of metal to ceramic.
通过XRD，EDX和SEM等手段对薄膜的分析表明，化学组成成分上与玻璃靶材相比没有变化，适合作为中间层为实现陶瓷与金属的阳极键合连接提供必要的前提条件。
化学
阳极键合
But as one of the packaging technology, anodic bonding of silicon-glass has many deficiencies.
但作为微机电系统封装的关键技术——半导体硅与玻璃的阳极键合技术，仍然存在着许多问题。
静电键合
Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS.
半导体硅与玻璃的静电键合技术是微电子机械系统(MEMS)的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
能源科学技术
阳极焊